Advanced Packaging Market Size, Share, Growth and Forecast to 2022-27
The latest research study " Advanced Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027 " offers a comprehensive analysis of the industry, which comprises insights on global advanced packaging market growth . The global advanced packaging market size reached US$ 32.53 Billion in 2021. Looking forward, IMARC Group expects the market to reach US$ 67.04 Billion by 2027, exhibiting a growth rate (CAGR) of 11.60% during 2022-2027. Advanced packaging refers to the interconnection and aggregation of components that enclose metallic parts and numerous devices, including wafers, logic units, and memory, to protect them from physical damage and corrosion during the final procedure of semiconductor manufacturing. It includes 2.5D, 3D-IC, system-in, and fan-out-wafer-level-package as a combination of several techniques. Advanced packaging methods are implemented after determining various parameters, such as power consumption, operating c